University of Washington Hosts Functional Materials and AM Symposium

Materials science is on the move at many universities and colleges across the nation. The University of Washington created the Advanced Materials & Additive Manufacturing (AM) Initiative and held their inaugural 3D Printing Symposium last March (2016) as a one day event.

Last year’s event had over 100 attendees with 28 percent industry and 72 percent UW students, faculty or alumni. They plan to continue the event this year, but expand it to a 2-day event this June 22 – 23, 2017.

The Additive Manufacturing and Functional Materials Symposium will bring together an international audience to discuss the cutting edge of additive manufacturing (AM) technologies. It will focus on the interface between AM and functional polymeric materials.
Confirmed speakers include:

  • Annalisa Chioppone (Istituto Italiano di Tecnologia)
  • Michael Dickey (NC State)
  • Igor Drstvenšek (University of Maribor)
  • Howon Lee (Rutgers)
  • Michael McAlpine (UMN)
  • Alshakim Nelson (UW-Seattle)
  • Eujin Pei (Brunel University London)
  • Kristina Shea (ETH Zurich)
  • Scott Phillips (Penn State University)

Registration is $50 for regular admission; $25 for students.
More details will be posted here.

In addition to the materials-focused event, under the same Advanced Materials & Additive Manufacturing Initiative, the University also held a Printed Electronics Summit earlier this month. You can read about it here.

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